Heat sink for electrical components

ABSTRACT

A heat sink assembly to dissipate heat from electrical components to a housing is disclosed. The housing is formed from a suitable heat sinking material including a body with integral continuous walls extending from the perimeter of the body. A carrier mechanism which retains a plurality of electrical components is positioned within the housing. The electrical components have heat sink tabs which are positioned in the housing such that the tabs are coupled with the housing to dissipate heat from the electrical components to the housing. A resilient biasing member including a plurality of resilient fingers is coupled with the carrier mechanism to retain the carrier and electrical components in position on the housing.

This is a division of application Ser. No. 115,951 filed Nov. 2, 1987now U.S. Pat. No. 4,845,590.

BACKGROUND AND SUMMARY OF THE INVENTION

The present invention relates to heat sinks and, more specifically, toheat sinks utilizing a resilient biasing member to retain electricalcomponents with heat sink tabs against a heat sink housing. The tabsdissipate heat from the electrical components to the housing.

In electronic modules, various components generate amounts of heat whichcannot be adequately dissipated to the ambient surrounding without theutilization of a heat sink. Printed circuit boards are used to provide asupport for the electrical conductors and the associated electricalcomponents, generally solid state devices, that make up the electronicmodule. In order to have an effective transfer of heat from the solidstate device to the heat sink, the solid state device must be securelyclamped to the heat sink. It is also desirable to have the solid statedevice mounted to the heat sink with a device that will permit its easyinstallation with the heat sink and also with the associated circuitboard. Further, it is desirable to have the solid state device (heatgenerating device) in close proximity to the associated circuit board soas to minimize the length of the conductors required for connecting thesolid state device to the circuit board.

The following U.S. patents illustrate devices utilized as heat sinks todissipate heat from electrical components to the ambient conditions.They are U.S. Pat. Nos. 4,674,005, entitled "Multiple Fastening Clip andDevice for the Collective Mounting of Electronic Power Components",issued June 16, 1987 to Lacz; 4,669,028, entitled "Heat Sink for SolidState Devices Connected to a Circuit Board", issued May 26, 1987 to Faa,Jr.; 4,625,260, entitled "Fasteners for Surface Mounting of PrintedCircuit Board Components", issued Nov. 25, 1986 to Jordan et al;4,613,925, entitled "Sensor Attachment Assembly", issued Sept. 23, 1986to Mohri et al; 4,609,040, entitled "Self-Securing Heat Sink", issuedSept. 2, 1986 to Moore; 4,509,839, entitled "Heat Dissipator forSemiconductor Devices", issued Apr. 9, 1985 to Lavochkin; 4,444,994,entitled "Electrically Insulated Quick Disconnect Heat Sink", issuedApr. 24, 1984 to Baker et al; 4,288,839, entitled "Solid State DeviceMounting and Heat Dissipating Assembly", issued Sept. 8, 1981 to Prageret al; 4,259,685, entitled "Clamp for Securing an Encased Power Frame toa Heat Sink", issued Mar. 31, 1981 to Romano; 4,203,488, entitled"Self-Fastened Heat Sinks", issued May 20, 1980 to Johnson et al;4,115,836, entitled "Cooling System for Dual-In-Line Packages", issuedSept. 19, 1978 to Hutchison et al; 3,893,161, entitled "FrictionallyEngageable Heat Sink For Solid State Devices", issued July 1, 1975 toPesak, Jr.; 3,711,752, entitled "Semiconductor Device and Method ofAssembling the Same", issued Jan. 16, 1973 to Nier; and IBM TechnicalDisclosure Bulletin, Volume 24, No. 7B, Dec., 1981.

While the above art appears to perform satisfactorily to dissipate heatfrom the electrical components, it has several disadvantages. Onedisadvantage is that several of the above device utilize removablefasteners such as screws, nuts and bolts, and the like to fasten thedevice to the heat sink. With the cycling (heating and cooling) of theelectrical components, it is possible that these connections will beloosened and eventually come off due to the cycling. Several of theabove devices are very complex and require a significant amount ofassembly.

Accordingly, it is an object of the present invention to overcome thedisadvantages of the above art. The present invention provides the artwith a heat sink assembly utilizing a frictionally and interferencesecured biasing member to position the electrical components against theheat sink material. The present invention provides the art with a heatsink assembly that may be assembled by automated processes.

Accordingly, the present invention provides the art with a new andimproved heat sink assembly. The heat sink assembly includes a housingformed from a suitable heat sinking material. The housing includes abody with integral continuous walls extending from the perimeter of thebody. A carrier mechanism for retaining a plurality of electricalcomponents is positioned within the housing such that heat sink tabs onthe electrical components are coupled with the housing to dissipate heatfrom the electrical components to the housing. The housing dissipatesheat to its external ambient. The housing, therefore, functions not onlyto mechanically protect the internal electronic components but alsofunctions as a heat sink for certain electronic components. A resilientbiasing member including a plurality of resilient fingers is coupledwith the carrier mechanism to retain the carrier mechanism andelectrical components in position on the housing.

Unlike most conventional circuit board mounted heat sinks, the presentinvention utilizes the walls of an electronic module's housing to act asa heat sink, thus dissipating unwanted heat to the electronic module'sexterior.

From the subsequent description and claims taken in conjunction with theaccompanying drawings, other objects and advantages of the presentinvention will become apparent to those skilled in the art.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of a heat sink assembly inaccordance with the present invention.

FIG. 2 is an assembled partial top plan view of FIG. 1.

FIG. 3 is a cross-section view of FIG. 2 along line 3--3 thereof.

FIG. 4 is a cross-section view of FIG. 2 along line 4--4 thereof.

FIG. 5 is a partial plan view of a resilient biasing member inaccordance with the present invention.

FIG. 6. is a side elevation view of FIG. 5.

FIG. 7, is a side elevation view, partially in cross-section, of anotherembodiment of a resilient biasing member in accordance with the presentinvention.

FIG. 8 is a side elevation view, partially in cross-section, of anotherembodiment of a resilient biasing member in accordance with the presentinvention.

FIG. 9 is a partial perspective view of an assembled heat sink assemblyin accordance with the present invention.

FIG. 10 is a partial top plan view of another embodiment of a solidstate device in accordance with the present invention.

FIG. 11 is a cross-section view of FIG. 10 along line 11--11 thereof.

FIG. 12 is a cross-section view of FIG. 11 along line 12--12 thereof.

FIG. 13 is a partial perspective view of another embodiment of a heatsink assembly in accordance with the present invention.

FIG. 14 is a cross-section view of FIG. 13 along a line 14--14 thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to the Figures, particularly FIG. 1, a heat sink assembly isshown and designated with the reference numeral 10. The heat sinkassembly 10 generally includes a housing 12 having a rectangular body 14and integral continuous walls 16, 18, 20 and 22 projecting from theperimeter of the body 14. The housing 12 is generally formed from asuitable heat sink material such as aluminum or the like. Carriermechanisms 24, retaining a plurality of electrical components 26, aregenerally positioned within the housing 12. A resilient biasing member28 is coupled with the carrier mechanisms 24 to secure the carriermechanisms 24 within the housing 12.

The housing 12 further includes projecting posts 30 to providesecurement and location of the resilient biasing member 28 to thehousing 12. A circuit board or the like 32 is generally positioned ontop of the housing body 14. A connector 34 (shown in phantom) interfacesthe circuit board(s) in housing 12 with other parts of externalelectrical components/system (not shown). Generally, one of the wallmembers 16 includes a plurality of ribs 36 and channels 38 to enableinstallation of a carrier bar 40. Also, a cover (not shown) is securedon top of the walls 16, 18, 20 and 22 to protect the electricalcomponents when the housing is mounted within a passenger compartment orengine compartment of a vehicle or other environment where the circuitboard needs protection. The use is not restricted to the automotiveenvironment.

The carrier mechanism 24 generally includes a carrier bar 40 having apair of support legs 42 extending therefrom. Retaining members 48,having a neck 50 and head 52, are formed at the other end of the supportleg 42 and are frictionally inserted into apertures in the circuit board32 to retain the carrier mechanisms 24 on the circuit board 32.

The carrier bar 40 includes retaining members 54, similar to theretaining members 48 on the support legs 42, having a neck portion 56and a head portion 58. The neck portion 56 has a length substantiallyequal to the thickness of the heat sink tabs 60 of the electricalcomponents 26. The retaining member 54 is pushed through an aperture 61in the heat sink tab 60 to retain the electrical components 26 inrecesses 63 on the carrier bar 40 of the carrier mechanism 24.

The carrier bar 40 is generally of a suitable plastic material having aflexibility (via material selection and mechanical design) toaccommodate minor varying thicknesses of the heat sink tabs 60.

The heat sink tabs 60 are positioned against the wall 16 such that theretaining members 54 project into the channels 38 between ribs 36, asseen in FIG. 2. The heat sink tabs 60 abut against successive ribs 36 tocontact the metallic tabs 60 with the metallic housing to dissipate heatfrom the electrical components 26 to the housing 12.

A lead alignment plate 44 is coupled with the carrier support legs 42 toalign the leads 46 of the electrical components 26 to enable them to beinserted into the circuit board 32, as seen in FIG. 4. The leadalignment plate 44 includes a plurality of apertures to pass the leads46 through the plate and align the leads 46 with apertures in thecircuit board.

An interior wall 62 may project from the housing body 14 within itsperimeter. The wall 62 provides additional heat sink capability andenables a second carrier mechanism 24 to be positioned against it. Aplurality of grooves 64 are cut into the wall 62 to enable the retainers54 of the carrier bar 40 to project therethrough. The wall 62 dissipatesheat from the tabs 60 of electrical components 26 to the housing 12.

The resilient biasing member 28 includes a body 66 and a plurality ofangularly extending fingers 68. The body 66 is generally planar havingat least one aperture 70 with a pair of retaining leaves 72 and 74 tosecure the resilient biasing member 28 onto the housing post 30. Thefingers 68 may have a curved end 76 for retention of the carriermechanism 24.

Generally, the number of fingers 68 correspond with the number ofelectrical components 26 that are to be retained in the carriermechanism 24. The fingers 68 may provide varying amounts of force to beexerted onto the electrical components 26 to forcibly retain thecomponents 26 against the walls 16 and 62. The varying of the exertedforce in each individual finger 68 enables multiple types of electricalcomponents 26 to be utilized in the system. The plurality of fingers 68are aligned such that each finger 68 is paired with an individualelectrical component 26 to forcibly position the heat sink tab 60 ofeach electrical component 26 against the housing walls 16 and 62 todissipate heat from the electrical components 26 to the housing 12, asseen in FIGS. 2 through 4. The individual fingers 68 enable use ofvarying thicknesses of heat sink tab 60. The spring action of thefingers 68 provides constant retention of the heat sink tabs 60 to thehousing walls 16 and 62 during thermal expansion/contraction conditionsimposed by the environment in which the housing is used.

The electrical components 26 could be of several types, however, thosewhich work particularly well are designated as having TO-220 type cases.

FIGS. 7 and 8 illustrate other embodiments of resilient members inaccordance with the present invention. In FIG. 7, a resilient biasingmember 80 is illustrated with a body member 82 and projecting angularfingers 84. The angular fingers 84 are substantially planar and contactthe carrier bar 40 to forcibly secure the electrical components 26against the housing wall 16 and interior wall 62.

FIG. 8 illustrates another type of resilient biasing member 90 that maybe utilized in the present invention. The biasing member 90 has a body92 and a plurality of extending angular fingers 94. The fingers 94 havean angular flange 96 depending from their end to further enhance theforce exerted on the electrical components 26 to secure the tabs 60 ofthe electrical components 26 against the walls 16 and 62.

Also, insulating material such as insulating tape 100 may be positionedbetween the electrical components 26 and the walls 16 and 62. Theinsulating material 100 electrically insulates the components 26 fromthe walls 16 and 62. However, the electrical insulating tape 100 acts asa conductor to dissipate heat from the electrical components 26 to thehousing walls 16 and 62. Thus, the insulating material 100 insulatesagainst electricity while conducting heat from the electrical components26 to the housing 12.

Moving to FIGS. 9, 10 and 11; FIG. 9 illustrates a heat sink assembly 10substantially the same as that in FIG. 1. FIGS. 10 and 11 show anotherembodiment of the present invention. The housing 12, carrier members 24,and electrical components 26 are substantially the same as describedherein.

The biasing member 120 includes spring fingers 122 and fingers 124. Thefingers 122 are shorter than the fingers 124. The fingers 122, asillustrated in FIGS. 10 and 11, abut the support legs 42 of the carriermechanisms 24 while fingers 124 abut the carrier bar 40. Thus, thefingers 122 and 124 force the carrier mechanisms 24 against the walls 16and 62. Fingers 124 may have the same or different widths according tothe force necessary to abut their particular electrical component 26against the walls 16 and 62. Generally, this type of spring is utilizedwhen a fewer number of electrical components 26 abut one wall 62 thanabut the other wall 16.

The spring fingers 122 and 124, other than having a different length andvarying widths, are substantially identical to one another. That is, thespring contains a body 128 with the fingers 122 and 124 angularlyprojecting therefrom. Curved ends 76 (essentially the same as describedabove) are formed at the end of the fingers 122 and 124. The body 128has apertures 70 with retaining leaves 72 and 74, like those describedherein, to retain the biasing member 120 onto the housing post 30.

FIG. 12 illustrates the carrier retaining member 48 which secures thesupport leg 42 to the lead plate 44 and circuit board 32. The neck 142generally has a peripheral tang 144 to seat the lead alignment plate 44thereon. Also, a head 52 is at the terminus of the neck 142 to retainthe carrier members 24 to the circuit board 32. A slot 148 is cutthrough the retaining member 48 from the head 52 through the neck 142 tothe support leg 42. The slot 148 enables the head 52 and neck 142 to besqueezed together to enable the head 52 and neck 142 to pass through theapertures 150 and 50 in the lead plate 44 and circuit board 32,respectively, to retain the lead plate 44 on the support leg 42 and toretain the support leg 42 in the circuit board 32.

The lead alignment plate 44 holds the leads 46 in position prior toinsertion of the carrier mechanism 24 into the circuit board 32. Thelead alignment plate 44 is an aid for insertion of multiple electricalcomponents 26 in one operation.

Turning to FIGS. 13 and 14, another embodiment of the present inventionis shown. Turning to FIG. 13, a biasing member 160 is illustrated havinga single row of biasing fingers 162. The housing 12 is substantially thesame as that herein described. The wall 16 is substantially identical tothat described herein. The housing 12 does not include an interior wallmember. The resilient member 160 includes a body 164 having angularlyprojecting fingers 162.

As seen in FIG. 14, the body member 164 has apertures and retainingleaves like those herein described to retain the biasing member 160 ontothe housing post 30. Thus, it can be seen that the resilient biasingmember 160 includes a single row of fingers to forcibly retain aplurality of electrical components 26 against the housing wall 16including ribs 36 and channels 38. Also, the resilient member mayinclude two rows of fingers to retain electrical components 26 againstboth of the housing walls 16 and 62 as described herein.

Generally, the above described heat sink assembly is manufactured inaccordance with the following. A housing, like that described herein,carrier means, at least one electrical component having a heat sink tab,and a resilient biasing member having at least one finger are providedfor assembly on an automated assembly line. The housing is positionedonto the assembly line by automated techniques. The carrier with itselectrical components already positioned thereon are positioned intoapertures in the circuit board by automated techniques. The desiredcomponents such as circuit boards and the like are then added to thehousing. The resilient biasing member is coupled with the carrier membersuch that the heat sink tabs of the electrical components on the carriermechanisms are coupled with the housing to dissipate heat from theelectrical components to the housing. The biasing member is located andretained by its apertures onto posts projecting from the housing. Thebiasing member is positioned onto the post and forced downwardly to besecured to the post by automated methods. As the resilient member isforcibly secured onto the post, each finger exerts a desired force ontothe specific electrical component to which it is aligned. The desiredforce exerted by the resilient fingers enables a plurality of differentelectrical components to be positioned on the carrier and forciblypushed against the housing for dissipating heat from the electricalcomponents to the housing.

While the above discloses the preferred embodiment of the presentinvention, it will be understood that modifications, variations, andalterations may be made to the present invention without varying fromthe scope and fair meaning of the subjoined claims.

What is claimed is:
 1. A carrier retaining electrical components havingleads within a housing comprising:a first non-conductive member; meansretaining electrical components on said first member, said retainingmeans integral with said first member; and a second non-conductivemember having means receiving the leads from said electrical componentsand aligning the leads of said electrical components such that they areinserted into a circuit board within the housing, said second membercoupled with said first member forming said carrier wherein said firstmember includes a pair of projecting posts coupled with said secondmember and retaining said first and second members in the circuit board.2. The carrier according to claim 1 wherein said retaining meansincludes one or more retaining members projecting from said first memberretaining said electrical components on said first member.
 3. Thecarrier according to claim 1 wherein said second member is a platehaving a plurality of apertures aligning said leads.